Home > Wafer Equipment

Semi Automatic Hollow Ball Wafer Production Line

It provides batter for the wafer production system. The system consists of batter mixing tank, storage tank, transmission pump and accessories to transfer batter.The batter mixing tank adopts N304 stainless steel, and the control box requires good water t
INQUIRY
Description
Semi Automatic Hollow Ball Wafer Production Line 
       
                                              
No. Machine Parts Dimension(mm) Power Quantity
1 Batter Mixer 1900×1100×950 4.5Kw 1
2 SH2 Semi Automatic Hollow Ball Machine 900×900×1900 10.52Kw 1
3 Automatic Sizing Machine 1200×500×600 0.75Kw 1

 
 
Technical Specifications of the Machines

1.Batter Mixer

It provides batter for the wafer production system. The system consists of batter mixing tank, storage tank, transmission pump and accessories to transfer batter.The batter mixing tank adopts N304 stainless steel, and the control box requires good water tightness.
The batter can be converted from 25 kilograms of flour to 65 kilograms of batter after mixing for 5 to 10 minutes.
The machine has a flat cover to cover the mixer.
The bearing of this machine chooses Chinese famous brand product.
a)
Stirring power: 3KW/380V/3/50hz
b)Transmission pump power:0.75KW/380V/3/50hz×1(The lift of the slurry pump:20m, Air pressure:0.004Mpa
The  gas consumption of pneumatic diaphragm pump :0.05m³/min/0.6Mpa
c.The conveying pipe adopts imported 304 stainless steel pipe.GB/T14976-94)

2.SH2 Semi Automatic Hollow Ball Machine

The wafer baking system uses electric to heat the baking plate.The machine is controlled by PLC of Japan, and the function of the oven is to automatically fill the batter with baking sheet. The cylinder is automatically baked for 3 minutes and can be automatically opened by the cylinder, and take out by human hand.
The machine is evenly baked and produced a quality wafer for further processing.A PID controller is used to automatically control the temperature of the oven.The acquisition of signals required by the controller is provided by an infrared temperature detector.
The AC contactor is provided by SCHENEIDER, which is produced in China.
Main technical parameters
The material of the die frame adopts reliable "ductile iron", the rigidity of the die frame ensures the stability of the oven.
Total number of plates: 2.
Bake block size: 470mm * 325mm.
Pattern: hemispherical.
Slice thickness: 2.2 + 0.15mm.
Output: the standard output is 2 pieces per 3 minutes.Generally 96 balls on each piece.
1920 balls per hour.

Template Electric Power: 10KW
Output power: Downsizing pump motor: 0.75Kw,380V/3/50Hz (SEW)
Compressed air consumption: 0.75cubic meter/min/0.8MPA Air pressure(FESTO or SMC.)
 
3.Automatic Sizing Machine

This machine presses the start button to automatically complete the batter sizing function. All rack components are made of stainless steel or food sanitation materials.
The drive motor is provided by the SEW.
Motor Provide: 0.18Kw, 380V / 50 Hz


 
+8615383380013